I-SMD & COB & GOB LED Ngubani oza kuba yitekhnoloji ekhokelwa ngumkhwa?
Ukusukela ekuphuhlisweni koShishino lokuBonisa i-LED, iintlobo ngeentlobo zemveliso kunye neenkqubo zokupakisha zetekhnoloji yokupakisha encinci ivele enye emva kwenye.
Ukusuka kwitekhnoloji yokupakisha ye-DIP yangaphambili ukuya kwitekhnoloji yokupakisha ye-SMD, ukuya ekuveleni kwetekhnoloji yokupakisha ye-COB, kwaye ekugqibeleni ukuya kuthi ga ekuveleniItekhnoloji yeGOB.
Itekhnoloji yokuPakisha iSMD
Itekhnoloji yokubonisa i-SMD LED
I-SMD sisishunqulelo se-Surface Mounted Devices.Iimveliso ze-LED ezifakwe yi-SMD (iteknoloji yokunyuka komgangatho) zifake iikomityi zesibane, izibiyeli, ii-wafers, ii-lead, i-epoxy resin, kunye nezinye izinto zibe ngamaso esibane ahlukeneyo.Sebenzisa umatshini wokubeka ohamba ngesantya esiphezulu ukuthengisa amaso esibane kwibhodi yesekethe kunye ne-high-temperature reflow soldering ukwenza iiyunithi zokubonisa ezinemibhobho eyahlukeneyo.
Itekhnoloji ye-SMD LED
Isithuba esincinci se-SMD sibonakalisa ngokubanzi amaso esibane se-LED okanye sisebenzisa imaski.Ngenxa yobuchwephesha obuvuthiweyo nobuzinzileyo, ixabiso eliphantsi lokwenziwa kokwenziwa, ukuchithwa kakuhle kobushushu, kunye nokugcinwa okufanelekileyo, ikwathatha isabelo esikhulu kwimakethi yesicelo se-LED.
Umboniso we-SMD we-LED ongundoqo osetyenziselwa ibhodi yebhodi yebhodi ye-LED esisigxina yangaphandle.
Itekhnoloji yokuPakisha iCOB
Umboniso we-COB LED
Igama elipheleleyo le-COB yokupakisha iteknoloji yiChips kwiBhodi, eyona teknoloji yokusombulula ingxaki yokutshatyalaliswa kobushushu be-LED.Xa kuthelekiswa ne-in-line kunye ne-SMD, ibonakaliswe ngokugcina indawo, ukwenza lula ukupakishwa kwemisebenzi, kunye neendlela ezisebenzayo zokulawula i-thermal.
Itekhnoloji ye-COB ye-LED
I-chip engenanto ibambelela kwi-substrate ye-interconnect kunye neglue eqhubayo okanye engaqhubekiyo, kwaye emva koko i-wire bonding yenziwa ukuqonda uxhulumaniso lwalo lombane.Ukuba i-chip engenanto ibonakaliswe ngokuthe ngqo emoyeni, iyakwazi ukungcoliswa okanye umonakalo owenziwe ngumntu, ochaphazela okanye utshabalalise umsebenzi we-chip, ngoko ke i-chip kunye neentambo zokudibanisa zifakwe ngeglue.Abantu bakwabiza olu hlobo lwe-encapsulation njenge-encapsulation ethambileyo.Ineenzuzo ezithile ngokubhekiselele ekusebenzeni kakuhle kwemveliso, ukuxhathisa okuphantsi kwe-thermal, umgangatho wokukhanya, isicelo, kunye neendleko.
SMD-VS-COB-LED-Display
Umboniso we-COB we-LED ophambili osetyenziswa kwi-pitch yangaphakathi kunye nencinci kunye ne-Energy esebenzayo ye-LED Screen Display.
Inkqubo yeTekhnoloji yeGOB
GOB Led umboniso
Njengoko sonke sisazi, ubuchwepheshe obuthathu obukhulu bokupakisha be-DIP, i-SMD, kunye ne-COB ukuza kuthi ga ngoku ihambelana ne-LED ye-chip-level technology, kwaye i-GOB ayibandakanyi ukukhuselwa kwee-chips ze-LED, kodwa kwimodyuli yokubonisa i-SMD, isixhobo se-SMD. Luhlobo lweteknoloji yokukhusela ukuba unyawo lwe-PIN lwe-bracket luzaliswe ngeglue.
I-GOB sisishunqulelo seGlue ebhodini.Ithekhnoloji yokusombulula ingxaki yokukhusela isibane se-LED.Isebenzisa imathiriyeli entsha ecacileyo yokupakisha i-substrate kunye neyunithi yayo yokupakisha ye-LED ukwenza ukhuseleko olusebenzayo.Izinto eziphathekayo azigcini nje ngokucaca okuphezulu kodwa zine-conductivity ephezulu ye-thermal.I-pitch encinci ye-GOB inokulungelelanisa kuyo nayiphi na indawo engqongileyo enzima, iqonda iimpawu zobungqina bobumanzi bokwenyani, amanzi, ubungqina bothuli, ukungqubuzana kunye ne-anti-UV.
Xa kuthelekiswa neSiboniso se-LED se-SMD yendabuko, iimpawu zayo zikhusela kakhulu, zikhusela umswakama, zingenamanzi, zichasene nokungqubana, i-anti-UV, kwaye zinokusetyenziswa kwiindawo ezinzima ngakumbi ukuphepha izibane ezifileyo zendawo enkulu kunye nezibane zokulahla.
Xa kuthelekiswa ne-COB, iimpawu zayo zilula ukugcinwa, iindleko eziphantsi zokugcinwa, i-angle enkulu yokujonga, i-angle yokujonga ethe tyaba, kunye ne-angle yokujonga ngokuthe nkqo inokufikelela kuma-degrees angama-180, enokusombulula ingxaki yokungakwazi kweCOB ukuxuba izibane, ukumodareyitha okunzulu, ukuhlukana kombala, umphezulu ombi umcaba, njl njl.
I-GOB engundoqo esetyenziswa kwi-Indoor ye-LED Poster Display Digital Advertising Screen.
Amanyathelo emveliso yochungechunge lwe-GOB yeemveliso ezintsha ahlulahlulwe ngokwamanqanaba ama-3:
1. Khetha ezona mathiriyeli zisemgangathweni, amaso esibane, izisombululo ze-IC yebrashi ephezulu kakhulu, kunye neechips ze-LED ezikumgangatho ophezulu.
2. Emva kokuba imveliso ihlanganiswe, igugile kwiiyure ezingama-72 ngaphambi kokuba i-GOB ifakwe, kwaye isibane sivavanywa.
3. Emva kwe-GOB potting, ukuguga ezinye iiyure ezingama-24 ukuqinisekisa umgangatho wemveliso.
Kukhuphiswano lwetekhnoloji yokupakisha ye-LED encinci, ukupakishwa kwe-SMD, iteknoloji yokupakisha yeCOB, kunye neteknoloji yeGOB.Ngokumalunga nokuba ngubani kwabathathu onokuphumelela ukhuphiswano, kuxhomekeke kubuchwepheshe obuphambili kunye nokwamkelwa kweemarike.Ngubani ophumeleleyo wokugqibela, masilinde sibone.
Ixesha lokuposa: Nov-23-2021